TECHNET Archives

1995

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Date:
Tue, 29 Aug 95 13:09:55
Content-Type:
text/plain
Parts/Attachments:
text/plain (61 lines)

     One thing to look at is the volume of PCB's run thru the Wave solder. 
     We use on the average of about 2000 lb's of solder per month per 
     machine (Electovert Ultrapak). We run on an average about 70,000 board 
     per Month , Because of the amount of new solder being introduced into 
     the pot contamination usually is not an issue (last pot change was 
     about 2 years ago. The frequency of the Tesing of your solder pot 
     could also be moved up, say if you are testing every 3 mo. then bump 
     it up to once month or so.
     
     Hope this helps you 
     
     ERic Bernal Process Engineer at Pragmatech, Sunnyvale, Ca
     [log in to unmask]


______________________________ Reply Separator _________________________________
Subject: solubility of gold into solder pot from Ni-Au board
Author:  [log in to unmask] at ~INTERNET
Date:    8/29/95 10:03 AM


Received: by ccmail
Received:  from netcomsv by pragma.com (UUPC/extended 1.11) with UUCP;
           Tue, 29 Aug 1995 10:03:17 PDT
Received: from miso.wwa.com by netcomsv.netcom.com with SMTP (8.6.12/SMI-4.1)
    id JAA25435; Tue, 29 Aug 1995 09:36:12 -0700
Resent-Date: Tue, 29 Aug 1995 09:36:12 -0700 
Received: from ipc by miso.wwa.com with uucp
    (Smail3.1.28.1 #8) id m0snTdg-000Fd1C; Tue, 29 Aug 95 11:35 CDT
Received: by ipchq.com (Smail3.1.28.1 #2)
    id m0snSrj-0000GmC; Tue, 29 Aug 95 10:46 CDT
Old-Return-Path: <miso!halsp.hitachi.com!ahlerta> 
Date: Tue, 29 Aug 95 08:35:26 PST
From: [log in to unmask]
X-ccAdmin: postmaster@netcomsv
Message-Id: <[log in to unmask]> 
To: [log in to unmask]
Cc: [log in to unmask], [log in to unmask] 
Subject: solubility of gold into solder pot from Ni-Au board 
Resent-Message-ID: <"WrP9R.0.G2E.APpGm"@ipc>
Resent-From: [log in to unmask]
X-ccAdmin: postmaster@netcomsv
X-Mailing-List: <[log in to unmask]> archive/latest/986 
X-Loop: [log in to unmask]
Precedence: list
Resent-Sender: [log in to unmask]
     
     We are studying use of Ni-Au plated circuit boards. One concern which 
     arose is that some of the gold will be dissolved as the board crosses 
     the solder wave and gradually contaminate the pot. Is this a valid 
     concern?
     We have never had a copper contamination problem even though we solder 
     many copper boards. We use a dual wave solder and RMA flux.
     Thanks,
     Allen Ahlert
     [log in to unmask]
     



ATOM RSS1 RSS2