Subject: | |
From: | |
Date: | Tue, 29 Aug 95 13:09:55 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
One thing to look at is the volume of PCB's run thru the Wave solder.
We use on the average of about 2000 lb's of solder per month per
machine (Electovert Ultrapak). We run on an average about 70,000 board
per Month , Because of the amount of new solder being introduced into
the pot contamination usually is not an issue (last pot change was
about 2 years ago. The frequency of the Tesing of your solder pot
could also be moved up, say if you are testing every 3 mo. then bump
it up to once month or so.
Hope this helps you
ERic Bernal Process Engineer at Pragmatech, Sunnyvale, Ca
[log in to unmask]
______________________________ Reply Separator _________________________________
Subject: solubility of gold into solder pot from Ni-Au board
Author: [log in to unmask] at ~INTERNET
Date: 8/29/95 10:03 AM
Received: by ccmail
Received: from netcomsv by pragma.com (UUPC/extended 1.11) with UUCP;
Tue, 29 Aug 1995 10:03:17 PDT
Received: from miso.wwa.com by netcomsv.netcom.com with SMTP (8.6.12/SMI-4.1)
id JAA25435; Tue, 29 Aug 1995 09:36:12 -0700
Resent-Date: Tue, 29 Aug 1995 09:36:12 -0700
Received: from ipc by miso.wwa.com with uucp
(Smail3.1.28.1 #8) id m0snTdg-000Fd1C; Tue, 29 Aug 95 11:35 CDT
Received: by ipchq.com (Smail3.1.28.1 #2)
id m0snSrj-0000GmC; Tue, 29 Aug 95 10:46 CDT
Old-Return-Path: <miso!halsp.hitachi.com!ahlerta>
Date: Tue, 29 Aug 95 08:35:26 PST
From: [log in to unmask]
X-ccAdmin: postmaster@netcomsv
Message-Id: <[log in to unmask]>
To: [log in to unmask]
Cc: [log in to unmask], [log in to unmask]
Subject: solubility of gold into solder pot from Ni-Au board
Resent-Message-ID: <"WrP9R.0.G2E.APpGm"@ipc>
Resent-From: [log in to unmask]
X-ccAdmin: postmaster@netcomsv
X-Mailing-List: <[log in to unmask]> archive/latest/986
X-Loop: [log in to unmask]
Precedence: list
Resent-Sender: [log in to unmask]
We are studying use of Ni-Au plated circuit boards. One concern which
arose is that some of the gold will be dissolved as the board crosses
the solder wave and gradually contaminate the pot. Is this a valid
concern?
We have never had a copper contamination problem even though we solder
many copper boards. We use a dual wave solder and RMA flux.
Thanks,
Allen Ahlert
[log in to unmask]
|
|
|