Patrick-
     
     You may also want to refer to the cover story in the May 1995 issue of 
     SMT Magazine, "Optimum Processing Prevents PQFP 'Popcorning' ," p39, 
     by P. Yalamanchili, R. Gannamani, R. Munamarty, P. McCluskey, and A. 
     Christou of the CALCE Electronic Packaging Research Center of the U. 
     of Maryland.
     
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______________________________ Forward Header __________________________________
Subject: Popcorn; Delamination: Floating
Author:  [log in to unmask] at _internet
Date:    8/15/95 2:58 PM


I could use some assistance in defining 'popcorn effect,' delamination,' and 
'floating' as it applies to components (BGA, fine pitch packages).
     
Any other known common component level phenomena (seen during 
assembly/soldering) and words used to identify them would be much appreciated 
as well.
     
Thank you,
Patrick Hassell
Electronic Packaging Services
(404) 524-0888
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