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1995

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From:
[log in to unmask] (Pat McGuine)
Date:
Thu, 21 Dec 1995 16:11:48 -0600
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Interesting.  At what temperature & pressure do you operate the airknife?


>______________________ Reply Separator__________________________
>Subject: (Fwd) TechNet Information
>Author:  [log in to unmask] at corp
>Date:    12/20/95 5:58 PM
>     
>I have been reading some E-mail regarding solder balling with 
>No-clean and water soluble fluxes recently.  I thought I might be 
>able to relay my solution to the solder balling problem in our 
>process in case it might help someone.
>     
>When we first started using water soluble flux, every board emerged 
>from the wave covered in minute solder balls adhered to the mask.  I 
>considered these to be a result of excess water remaining in the flux 
>at the point of wave contact, vaporizing rapidly, and blowing solder 
>all over the mask.  To eliminate the problem, I pre-heated our flux 
>removal airknife.  This causes a high temperature jet of air to pass over the 
>entire board prior to preheating but after flux application.  The 
>heated air reduces the amount of volatiles in the flux such as water and 
>eliminates solder balling.  We haven't had a solder ball since.
>     
>Thanks
>Jason Spera
>[log in to unmask]
>     
>

-Pat-

-------------
Patrick McGuine
Nicolet Instrument
[log in to unmask]
(608) 276-6334



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