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1995

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Subject:
From:
Thomas Dammrich <[log in to unmask]>
Date:
Sat, 6 May 1995 20:38:26 -0500 (CDT)
Content-Type:
TEXT/PLAIN
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TEXT/PLAIN (25 lines)
This request is forwarded to TechNet users from NECAonline.

---------- Forwarded message ----------
Date: Thu, 4 May 1995 21:09:37 -0400
From:[log in to unmask]
To: [log in to unmask], [log in to unmask], [log in to unmask], [log in to unmask]
Subject: Question:Etcher Goop

If anyone can help Gary with this question please reply to NECAonline Subj:
Etcher Goop
--------------------------------------------------------
Larry--I'm looking for information from anyone who has had experience with
aqueous photoresist leaching into cupric chloride etch.  We are forming what
DuPont calls etcher goop, which is contaminating our equipment and
redepositing
on inner layers, causing shorts.  We understand the cause and know how to
minimize it, but I would like some feedback from anyone else who has dealt
with
this.  I would like some examples of types of aqueous resists which have not
had this problem, if any exist.  DuPont and Dynachem are involved, and now I
need some unbiased inputs (users, not suppliers).  Thanks.  Gary Greenberg




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