&[DC] Attention Engineers and Designers (1 Message)
(ASSM) Crimping (2 Messages)
(no subject) (1 Message)
(TN) Comparitive Tracking Index (2 Messages)
(unknown chars): QS-9000 (1 Message)
+j2xT0Q-: QS-9000 (1 Message)
.was no subject, now wrong polarity (1 Message)
10/90 solder to copper bonding (2 Messages)
1998 Summit on PWB Surface Finishes and Solderability (1 Message)
20 mil pitch part pad pattern (1 Message)
240 Pin PQFP Solderability Problems (2 Messages)
304-pin PQFP Placement & Solderability (4 Messages)
: Fine Pitch (208 QFP) (1 Message)
<No subject> (26 Messages)
<None> (1 Message)
A fix for warped PCBs (2 Messages)
About IPC-PC-90 (2 Messages)
Adhesive coating for hot wires (3 Messages)
Adhesive coating for hot wires -Reply (1 Message)
Admin Response: Free Copy J-STD-005 AMD 1 (2 Messages)
Admin Test Message - Please Disregard (5 Messages)
admin: strange attachment files, was: Read: No-clean (4 Messages)
Administrator:Help! (2 Messages)
Air quality monitor (8 Messages)
Al wire bonding to elNi/imAu (4 Messages)
ALERT: GroupShield has suspended a message from "Dhawan, Ashok" <[log in to unmask]> in SCAN.BOX (1 Message)
Alingment for Optical Sub-Assembly (2 Messages)
Alloy List (2 Messages)
Alpha Leveling (1 Message)
AlphaLEVEL (1 Message)
Alternative to HFC 134A (2 Messages)
American Std. test method (1 Message)
ANSI/J-STD 004 Interpretation (3 Messages)
ANSI/J-STD004 (4 Messages)
Arhenius equation needed for thermal degradation of PWBs (1 Message)
Arlon Corp. (8 Messages)
Asking SN200 thermal coefficient (2 Messages)
Aspect Ratio (1 Message)
Assembly: Dynaflex 2000S Rigid-flex circuit board (1 Message)
Assy (2 Messages)
ASSY: Conformal Coating Performance (8 Messages)
ASSY: Dummy Components (5 Messages)
Assy: Gauge R&R Methodology (2 Messages)
Assy: How can a square peg fit in a round hole? (24 Messages)
Assy: How can a square peg fit in a round hole? -Reply (4 Messages)
ASSY: IPC/SMTA Electronics Assembly Expo Schedule (4 Messages)
ASSY: PBGA on PCMCIA card (2 Messages)
Assy: Questions about panel layout... (10 Messages)
ASSY: Saponifiers (6 Messages)
Assy:Any names of PCA Repair companies in "Silico (2 Messages)
Assy:Any names of PCA Repair companies in "Silicon Valle y"? (1 Message)
Assy:Any names of PCA Repair companies in "Silicon Valley"? (6 Messages)
Bare Board (1 Message)
bareboard testing (1 Message)
Batch cleaning of SMT RMA fluxes (8 Messages)
benchtop wavesoldering rework machine (8 Messages)
Bending Stress on SMT Devices (6 Messages)
Better gloves or finger cots (2 Messages)
BGA & MicroBGA Stencils? (4 Messages)
BGA and Electroless nickel (1 Message)
BGA dogbone...Can we get rid of it? (4 Messages)
BGA Dummies with Daisy Chain (2 Messages)
BGA Reballing (12 Messages)
BGA Underfill (8 Messages)
BGA X-ray inspection (1 Message)
BGA's (2 Messages)
BGA'S IN SPACE (14 Messages)
BGA/Layers Matrix (2 Messages)
Black Oxide versus White Oxide (2 Messages)
Blind Via High asprct ratio, Nickel, Semi cond CWF(Complex Wave Form) (2 Messages)
Bottomside thanx (1 Message)
Bubbles from conformally coated board (1 Message)
BULKFEEDERS ; Is resistor orientation (upside down) a concern ? (1 Message)
Buried Capacitance (1 Message)
Buried Capacitance/electrodes connection to surface? (2 Messages)
C.O.P.S. Software problems (1 Message)
Call for papers (1 Message)
CAM Software for Pick & Place (1 Message)
Cancel Subscription (2 Messages)
Capacitor cracked (2 Messages)
Castin alloy from AIM (2 Messages)
Chip resistor trimming (2 Messages)
Chip Resistors (1 Message)
Clean Room Requirements for die attach, wire bonding, and encapsulation (2 Messages)
Cleaning No Clean PCB's - best practice (4 Messages)
Cleaning solvent for PWB (4 Messages)
COG assembly reference (2 Messages)
Commercial TACTech equivalent (1 Message)
Company's own Standards....necessary (1 Message)
Company's own Standards....necessary?? (5 Messages)
Complex wave form -pulse plating (2 Messages)
Conductive Inks (8 Messages)
Conductive Inks, Reply (2 Messages)
Confirmation of Receipt (4 Messages)
confused... (2 Messages)
Consultant-Epoxy transfer molding Compound (2 Messages)
Controlled Impedance (2 Messages)
Conversion (2 Messages)
Conversion Program (8 Messages)
Coplanarity Adjustment (4 Messages)
Copper corrosion (3 Messages)
Copper track temperature query (1 Message)
Copyright infringement (1 Message)
corrected Web Link for Assembly Tech Expo (2 Messages)
cracking resistors (6 Messages)
CTE of PCB material. (2 Messages)
cupric chloride etcher controllers (12 Messages)
CV-Theda to Allegro (2 Messages)
Depaneling (4 Messages)
DES: "S-glass" Fibre Reinforcem (2 Messages)
DES: "S-glass" Fibre Reinforcement (8 Messages)
DES: Gerber to Cad Netlist Comparison (Netlist Compare) (2 Messages)
DES: How do we compare (2 Messages)
Developments in reliability testing (18 Messages)
DFM design rules ? (2 Messages)
DFM guidelines (9 Messages)
DFM Tools (2 Messages)
Dhavan Ashok (2 Messages)
Diagnostic Circuit manufacturers? (1 Message)
Dielectric strength (10 Messages)
Direct Metalization Over Gold (4 Messages)
Diversion, flame if you will! (3 Messages)
Does this New Time Clock System solve the Y2K problem? (2 Messages)
Double messages in Technet (4 Messages)
Double Your Money (6 Messages)
Dover-Soltec software (1 Message)
DRAM Testing (2 Messages)
Dropped boards (2 Messages)
Dust Particle count (2 Messages)
Electroless Lead Plating (4 Messages)
Electroless Nickel (3 Messages)
ELECTROLESS NICKEL HANDBOOK. (1 Message)
Epoxy Adhesive curing (4 Messages)
ESD/Ionization information (4 Messages)
European Lead Ban (8 Messages)
Excellon Drill/Router Maintenance Service Providers (3 Messages)
FAB: Discoloration of electrolytic gold (2 Messages)
fab: European Board Spec Interpretation (4 Messages)
fab: Hull cell (was: Please help me...) (4 Messages)
fab: Plasma etch of PTFE (2 Messages)
Fab: Request for defect visuals (1 Message)
Fiber, solderballs, white residue on flex (2 Messages)
Film Stabilization (11 Messages)
Fine Pitch (8 Messages)
Fine pitch (1.0 mm) PBGA prototyping (1 Message)
Fine Pitch IC coplanrity standard??? (1 Message)
Fine Pitch Pin-In-Hole (3 Messages)
flex circuit thermal profiles (2 Messages)
Flex Delamination Acceptiblilty (2 Messages)
flex of board vs. SMT components (1 Message)
flux action (2 Messages)
Flux/Underfill (4 Messages)
Footprint Width for Fine Pitch Devices (2 Messages)
Formula for surface tension of molten solder (1 Message)
FR-5 definition (6 Messages)
FR5 vendor (2 Messages)
Free Copy J-STD-005 AMD 1 (1 Message)
Free Solder Alloy Chart (1 Message)
FTIR (4 Messages)
Fumes and wavesoldering pallets (3 Messages)
GEN: european lead ban (8 Messages)
GEN: MELF standards (1 Message)
Gerber Systems laser photoplotters. (4 Messages)
Gerber/Composer help (1 Message)
GFT laminate/prepreg source (2 Messages)
Glenbrook x-ray THE SAGA Continues (1 Message)
Glenbrook x-ray?? (2 Messages)
Gold & Wire Bond (2 Messages)
Gold & Wire Bond -Reply (2 Messages)
Gold Boards - Sn/Pb/Ag - Reliability (2 Messages)
Gold Immersion and planarity (6 Messages)
gold plating resists (14 Messages)
Gold Wire Exposure (3 Messages)
Handling Moisture Sensitive Components (6 Messages)
HASL v/s OSP (4 Messages)
Heating Of PCB Track (4 Messages)
Help needed: Attaching leadless ceramic smd (14 Messages)
help with acronym "STD" (12 Messages)
HELP! Conformally coating on no clean flux pcb (5 Messages)
High temp press pads (1 Message)
High Temp Solder Reflow Profile (2 Messages)
hot melts (4 Messages)
How to calculate termination area on LCC with DSR (1 Message)
Hubbell High Bay Lights (1 Message)
Hydrogen/Nitrogen safety issues (4 Messages)
Hydrogen/Nitrogen saftey issues (6 Messages)
ic package (4 Messages)
Imbedded components (10 Messages)
Imbedded components--Thanks (10 Messages)
Immersion Au over Ni (2 Messages)
IMMERSION GOLD (4 Messages)
Imperial to metric conversion (2 Messages)
Imperial to metric convertion (4 Messages)
Imperial to metric convertion ? (4 Messages)
Industry Standard for Assembly Drawing (1 Message)
Installation Assistance - Radial Insertion (1 Message)
Insuff.Solder (4 Messages)
Intrusion Reflow (was Fine (1 Message)
Intrusion Reflow (was Fine Pitch Pin-In-Hole) (1 Message)
Ionic Testers (1 Message)
IPC Expo '99 - Deadline - Call for Papers (4 Messages)
IPC-A-600 INTERPRETATION - RESENDING - (2 Messages)
IPC-SM-782 (4 Messages)
IPCchat session announcement (2 Messages)
Is Al to Ni wirebonding possible (9 Messages)
Is resistor orientation (upside down) a concern? (2 Messages)
J-STD-020 (6 Messages)
J-Std-020 & EIAJ Profile (4 Messages)
Lab analysis of solder joints. (1 Message)
Lab Management Software (4 Messages)
Lamination process control (6 Messages)
las vegas area (2 Messages)
Laser marking of die concern (2 Messages)
Lead cutting standardization (2 Messages)
LeadBending (2 Messages)
LED Problem (2 Messages)
Leftover Solder Paste (14 Messages)
Looking for Sensitizer for Presensitized PC Boards... (2 Messages)
Magnification IPC-A-600 (6 Messages)
manufacture of oversized pwb (5 Messages)
MC3D material (3 Messages)
Meeting Notice: IPC Designers Council - Pacific NW Chapter (2 Messages)
MEMO (6 Messages)
Message status - undeliverable (1 Message)
MetCal Irons (15 Messages)
MetCal Irons -Reply (2 Messages)
Metcal tip cartridges (2 Messages)
Mica Sheet Bonding (2 Messages)
Micro BGA (7 Messages)
microetchant (1 Message)
MIL -IPC CONVERSION (2 Messages)
mil specs; crystal controlled clock oscillators (4 Messages)
MIL-2000 Lead Tinning? (6 Messages)
MIL-IPC CONVERSION (2 Messages)
Mil-S-13949 (1 Message)
Mil-Std Tinning (2 Messages)
MIL-STD-1695 (2 Messages)
Moisture Sensitive Components (6 Messages)
More Controlled Impedance (10 Messages)
MSMT = ? (2 Messages)
Multiline glass frames (4 Messages)
Mydata's and Unicam (6 Messages)
Nd:YAG Laser welding for heatsink attachment (4 Messages)
NDT testing (2 Messages)
Need x-ray inspection (8 Messages)
Net list help (9 Messages)
New Designer (3 Messages)
New Designer Certification Workshop/Exam Date (2 Messages)
New Designer!! (10 Messages)
New Designer!! -Reply (3 Messages)
new e-mail address. (3 Messages)
new Tyco email address (1 Message)
nichrome etchant? (4 Messages)
nitrogen diffuser cleaning (2 Messages)
Nitrogen hot boxes. (2 Messages)
Nitrogen/Hydrogen (4 Messages)
No-clean Fluxes + Omegameters (4 Messages)
No-clean solder......Military Contracts (1 Message)
Non-Plated-Thru Hole Solder Joints (4 Messages)
Non-PTH solder joints (2 Messages)
Nonconductive Adhesives in lieu of Lamination (2 Messages)
Nordson Select Coat Machine (4 Messages)
Not read: No-clean solder......Military Contracts (5 Messages)
Not read: Re: [TN] reforming a SOIC (2 Messages)
Not read: [TN] Lead Solderability II (1 Message)
OEM's Database. (1 Message)
Old Backup Device (2 Messages)
Old Stencils (8 Messages)
Omikron White Tin (18 Messages)
Omikron White Tin(shelf life) (4 Messages)
On-Line Dictionary (3 Messages)
oooppss... (1 Message)
OOPS!...Ultrasonic Cleaner contact numbers... (2 Messages)
Open Vias (8 Messages)
Optically transparent epoxy (4 Messages)
OSP v/s press-fit connectors. (14 Messages)
OXIDATION OF LEADS (2 Messages)
Pacovia Alternative (2 Messages)
PADs Database Errors (4 Messages)
Palladium PCBs (8 Messages)
Panasert SPP-A(LL) Screen Printer (2 Messages)
Paste Printing (12 Messages)
PC board mount transformer problem (4 Messages)
PC Board Surface Mount Solderability (6 Messages)
PCB Delamination? (2 Messages)
PCB labeling (8 Messages)
PCB labelling (2 Messages)
PCB Pad Strength (4 Messages)
PCB panel design. (6 Messages)
PCB substrate thickness (4 Messages)
PCB Warp / Bow & Twist (1 Message)
PCB Warp / Bow & Twist - Reply (1 Message)
Peelable SM (6 Messages)
peelable soldermask (2 Messages)
PEELING GOLD (3 Messages)
Permasil? tape and Clearwater cleaning agents (2 Messages)
PGA Module testing (2 Messages)
Phosphour in Electroless Nickel (1 Message)
Phototool issues. (4 Messages)
PIP (1 Message)
Plating Compositions and Thicknesses (1 Message)
Plating Thickness (3 Messages)
Please help me, if you can. (8 Messages)
Please unsubscribe (2 Messages)
Polyurethane molding compounds (4 Messages)
Pressfit Connector Process Inquiry (2 Messages)
Profiles for flex circuits (4 Messages)
PT-1447 AOI (4 Messages)
PTH Drill Holes ? (2 Messages)
Qualification of populated MCM-L (1 Message)
Quality testing condition for PCB and CCL (8 Messages)
Question about polyimide TCE (2 Messages)
Question About Polyinmide TCE (2 Messages)
QUESTION: SMT Topside plus Through Hole Insertion Stre (4 Messages)
QUESTION: SMT Topside plus Through Hole Insertion Stress (4 Messages)
Questions about KLEENOX "P" (8 Messages)
RE : Traveller/Pre-Engineering/Methods document software (1 Message)
RE : [TN] Arlon Corp. (2 Messages)
RE : [TN] Pacovia Alternative (1 Message)
RE : [TN] Thermal Cycling (2 Messages)
Re Turbidity (1 Message)
Read: No-clean solder......Military Contracts (20 Messages)
Read: [TN] Dielectric Strength (4 Messages)
Read: [TN] No-clean solder......Military (2 Messages)
Read: [TN] reforming a SOIC (4 Messages)
Recall: Re-tipping Metcal irons (4 Messages)
Recall: [TN] research on Vibrators and there effects on the flui (1 Message)
Reflow of Nylon 6/6 Connector? (4 Messages)
reforming a SOIC (14 Messages)
Refurbished Screen Printer Recommendations? (8 Messages)
Refurbished Screen Printer Recommendations? -Reply (2 Messages)
Reliability data on wire solder joints (6 Messages)
Reliability Testing (2 Messages)
research on Vibrators and there effects (2 Messages)
research on Vibrators and there effects on the flui (5 Messages)
research on Vibrators and there effects on the fluid mechanics (1 Message)
Resent: 1.0mm BGA guidelines (1 Message)
Resistor Orientation (1 Message)
Respirators (3 Messages)
Reverved Polarity on Caps (1 Message)
RF Screening (2 Messages)
RMA Flux Removal (1 Message)
Roku-Roku Sangyo, Ltd. (2 Messages)
Salaries for PCB Designers (8 Messages)
Scoring (1 Message)
Search for conductive printing on PVC (2 Messages)
Search for flexible PWB (2 Messages)
Search for printing on PVC (2 Messages)
SED (Static Event Detectors) (2 Messages)
Selective Electroless Ni/Immersion Gold??? (3 Messages)
Separating Flex Circuits (7 Messages)
Shear Test Standards (8 Messages)
SIGNOFF TechNet (2 Messages)
Silicon contamination (4 Messages)
Silicon contamination -Reply (1 Message)
Silver Finish (8 Messages)
Simulation (5 Messages)
SINTERED ALUMINUM (1 Message)
slam package? (4 Messages)
small reflow oven (4 Messages)
SMD pads on hybrids (1 Message)
SMT Ceramic Caps (4 Messages)
SMT gull wing solder joint force test? (8 Messages)
SMT layout planning (1 Message)
SMTA mtg (Open to all) Surface Finish on PCB Assys (1 Message)
SNEC meeting (2 Messages)
Solder Bridges (2 Messages)
Solder Bridges under BGAs (8 Messages)
solder defect (6 Messages)
Solder Irons (4 Messages)
Solder mask materials and equitements wanted (2 Messages)
Solder on fingers (3 Messages)
Solder on Gold Finger (2 Messages)
Solder on pads (4 Messages)
Solder paste printing (2 Messages)
solder short (1 Message)
Solder Shorts on Radial Transistors (10 Messages)
solder stencil (4 Messages)
solder strippers (6 Messages)
Solder temperature (10 Messages)
Solder temperature [90/10 Sn/Pb] (2 Messages)
Solder to nickel (1 Message)
Soldering Iron temperature for Rework (12 Messages)
Soldering to Electroless Nickel Plating (4 Messages)
Spacing from chassis (6 Messages)
Speaking of cluttered e-mail in-boxes (12 Messages)
Specific gravity of electroless copper (2 Messages)
SQFP 32x32-240 in IPC-SM782A (2 Messages)
Square Pegs & Round Holes (2 Messages)
Standards (7 Messages)
stencil printing bottomside glue (3 Messages)
stencils (2 Messages)
Stencils for Gold Boards (2 Messages)
Stencils for Gold Boards -Reply (18 Messages)
Stick Magazines (2 Messages)
Strippers (20 Messages)
Strippers -Reply (4 Messages)
Subj: Solder Force On SMT Bottom Side (1 Message)
Subject: slam package? (2 Messages)
Subject: solder strippers (2 Messages)
subscribe (2 Messages)
subscription (1 Message)
Sulfuric Postdip (10 Messages)
Surface Finishing (4 Messages)
Surface mounting attachment for RF shields (5 Messages)
Tape on DIP Switch (6 Messages)
TechNet Digest - 13 Aug 1998 - Special issue (1 Message)
TechNet Digest - 26 Aug 1998 - Special issue (1 Message)
Technical Notebooks (3 Messages)
Tenting of vias (6 Messages)
terminology: thermal asperity (2 Messages)
test message please ignore (2 Messages)
Testing of transformer coils (6 Messages)
Tetra-Etch (6 Messages)
The Application of ENIG (4 Messages)
The ideal eletronic encapsulation material? (11 Messages)
thermal asperity (2 Messages)
Thermal Cycling (8 Messages)
Thermal Profilers (18 Messages)
Thermal Profilers -Reply (2 Messages)
Thermal profiles for flex circuits (2 Messages)
Thinner for Alpha 615/25 flux (1 Message)
This is a TechNet test (2 Messages)
Throwing Power (1 Message)
To Do List (1 Message)
To Subscribe/Unsubscribe (2 Messages)
Transistor Leads Shorting (2 Messages)
Translator CV to Allegro (6 Messages)
Traveller/Pre-Engineering/Methods document software (1 Message)
Turbidity Test (3 Messages)
uBGA Dummy Components and Vehicle Test Boards (1 Message)
Ultra-Sonic Cleaning (2 Messages)
Unidentified Material Between Conductors (3 Messages)
Unregistered SMT components (1 Message)
Urethane for Staking Material (2 Messages)
Urethane Staking Compounds (4 Messages)
VECTRAN (2 Messages)
Via on lands (2 Messages)
VSOP 40 (3 Messages)
w72 (1 Message)
Wanted: Great burn-in Systems (2 Messages)
Wave Soldering Test (1 Message)
Wave temperature (2 Messages)
Wavy board surface - NOT delamination? (4 Messages)
white residue (12 Messages)
Winmail.dat files (2 Messages)
Wire Bonding (3 Messages)
x-ray analysis (2 Messages)
X-RAY BGA REWORK (4 Messages)
X-Ray machines for PCB inspection after drill. (3 Messages)
Your First Flex Circuit (2 Messages)
[CN] IPC D.C. Update - Week of August 24, 1998 (3 Messages)
[CN] IPC/SMTA Electronics Assembly Expo Schedule (1 Message)
[CN] May I Send You Some Information? (1 Message)
[CN] Pre-treatment Standards (2 Messages)
[DC] A question on Job Postings (7 Messages)
[DC] Admin Test Message - Disregard (1 Message)
[DC] And today's question is........... (4 Messages)
[DC] BGA Question (2 Messages)
[DC] BGA/Layers Matrix (1 Message)
[DC] CV-Theda to Allegro (1 Message)
[DC] DES: Gerber to Cad Netlist Comparison (Netlist Compare) (1 Message)
[DC] DES: Xtended Temp 16Mb DRAM (2 Messages)
[DC] Design Operations Manager-Posting (1 Message)
[DC] Double Your Money (1 Message)
[DC] feetprint pattern (1 Message)
[DC] FW: PTH Drill Holes ? (4 Messages)
[DC] Gerber netlist compare (1 Message)
[DC] Gerber to PostScript conversion (1 Message)
[DC] High Speed Interconnects (1 Message)
[DC] Houston high speed training class (1 Message)
[DC] How to estimate the time and place needed for a layout? (6 Messages)
[DC] Hull Cell Scale (1 Message)
[DC] IPC-D-275 test coupons (2 Messages)
[DC] IPC/SMTA Electronics Assembly Expo Schedule (1 Message)
[DC] max current for via*s (1 Message)
[DC] Meeting Notice: IPC Designers Council - Pacific NW Chapter (1 Message)
[DC] Melf SOD-87 (1 Message)
[DC] My first Flex circuit ... and I have a question (2 Messages)
[DC] New Designer Certification Workshop/Exam Date (1 Message)
[DC] PADs Database Errors (4 Messages)
[DC] Sr. Cadence PCB Designer- Job Opportunities (1 Message)
[DC] stripline specifications (1 Message)
[DC] Translator ( CV to Allegro ) (1 Message)
[DC] Your request to sign off the DesignerCouncil list (1 Message)
[Fab] Emperical Impedances (8 Messages)
[Fab] Fracturing (4 Messages)
[TN] 304-pin PQFP Placement & Solderability (4 Messages)
[TN] BGA'S IN SPACE (2 Messages)
[TN] Buried Capacitance (5 Messages)
[TN] Clean Room Requirements for die attach, wire bonding, an d encapsulation (1 Message)
[TN] Company's own Standards....necessary?? (1 Message)
[TN] Handling Moisture Sensitive Components (4 Messages)
[TN] HASL v/s OSP (1 Message)
[TN] Hydrogen/Nitrogen saftey issues (4 Messages)
[TN] Intrusion Reflow (was Fine Pitch Pin-In-Hole) (1 Message)
[TN] Net list help (1 Message)
[TN] New Designer (2 Messages)
[TN] New Designer!! (1 Message)
[TN] Not read: No-clean solder......Military Contracts (1 Message)
[TN] Questions about KLEENOX "P" (1 Message)
[TN] reforming a SOIC (10 Messages)
[TN] Solder to nickel (2 Messages)
[TN] Soldering to Electroless Nickel Plating (2 Messages)
[TN] Tetra-Etch (1 Message)