Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 10 Aug 1998 10:04:46 -0700 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Dear Technetters,
Some people have asked what I am looking for in specfics, so I am sending it
again. We are gathering any information helpful to 1.0 mm BGA design etc.
Any information/guidelines related to board design, fabrication and
assembly, and handling & shipping would be very helpful.
Thanks,
Yuan Li
Packaging Engineer
Altera Corp.
101 Innovation Drive, M/S 4101
San Jose, CA 95134
(408)544-7508
Fax (408) 544-6419
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################
|
|
|