Hi Ed,

        That's quite a list and rather optomistic I'm sure. I know of no such
material that can meet all the specs, however one of our Lab Techs came in the
other day with a bottle of the universal solvent...........

        Maybe your expectations are to defeat the laws of Physics.
Seriously though, I hope you find what you are looking for. I'd be interested
if you do find such an encapsulant.

Regards,
Les
>  From: Edward Boucher <[log in to unmask]>, on 8/12/98 4:48 PM:
>  Greetings Technet,
>
>   Dose anyone know of a encapsulating material for electronics, which can
>  meet  the majority of these parameters?  We have been searching for about a
>  year and have had little success.
>
>  The Ideal Encapsulation Material
>
>  a.  low toxicity
>  b.  low moisture permeability
>  c.  no or very low ionic content
>  d.  low viscosity
>  e.  low linear shrinkage
>  f.  low glass transition temperature (Tg)
>  g.  low Coefficient Of Expansion (CTE)
>  h.  low embedment stress
>  i.  high tensile strength
>  j.  high thermal conductivity
>  k.  void free
>  l.  electrical insulation properties
>  m.  thermal cycling stability
>  n.  high thermal shock resistance
>  o.  wide temperature range -55 to 95 degrees C
>  p.  good chemical and solvent resistance
>  q.  good adhesion
>  r.  low cost
>  s.  ease of processing (application and clean up)
>  t.  no formation of water
>  u.  non-corrosive
>  v.  easily repairable
>
>
>  Your help is appreciated...
>
>  Ed Boucher
>  Engineering R&D Tech.
>  K and M Electronics
>  413-263-6253
>
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