Hi Jaquet,

        I have heard this touted for several years, and at TI in Austin,Tx  we
had several samples sent out to demonstrate the ability to plate more in the
hole than on the surface. The suppliers were never able to demonstrate the
capability. The panels always came back with more plating on the surface than
in the hole. We tried at least to suppliers that made the claim. I would be
interested in the supplier, either of Pulse plating equipment or Plating
Chemistry, that can verify the claim.

Thanks,
Les Connally

>  From: Lanoline <[log in to unmask]>, on 7/29/98 6:56 PM:
>  Hi Sarah,
>
>  Yes it is possible that the plating thickness on the surface is less than in
>  the hole, in particular if the plating was done using the Pulse Plating
>  technology.
>
>
>  -----Message d'origine-----
>  De : sarah <[log in to unmask]>
>  + : [log in to unmask] <[log in to unmask]>
>  Date : mercredi, 29. juillet 1998 15:39
>  Objet : [TN] Plating Thickness
>
>
>  >Hi everyone
>  >
>  >Please pardon me for my ignorance regarding this
>  >matter but I will ask this question anyway:
>  >- is it possible that the plating thickness on the board
>  >  surface is less than that of the T/H?
>  >- what might be the cause of this type of phenomenon?
>  >
>  >Any comments or information anyone could provide
>  >is highly appreciated.
>  >
>  >
>  >thanks
>  >Sarah
>  >
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