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August 1998

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Subject:
Re: slam package?
From:
"Leslie O. Connally" <[log in to unmask]>
Reply To:
Leslie O. Connally
Date:
Fri, 28 Aug 1998 13:04:34 -0500
Content-Type:
text/plain
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text/plain (58 lines) 
Hi Jeremy,

I'll try to answer this one, with somewhat "tongue in cheek". As I recall the
terminology came from some early Multichip Module acronyms meaning Sequential
Lamination Module (SLAM). This was a sequentially laminated reinforced resin
fanout MCM. We built some as a carrier for BGA's to mount to a less complex
printed wiring board. The proper terminology was MCML. I could be wrong, but
this is my recollection. Anyone else recall ??

Regards,
Les

>  From: Jeremy Drake <[log in to unmask]>, on 8/26/98 2:25 PM:
>  Anyone in Technet land heard of slam electronic packages? I can't find them
>  as a JEDEC outline. Do they exist? What are they?
>
>  regards,  Jeremy Drake
>  Celestica
>
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