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August 1998

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Subject:
From:
Steve Plant <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 11 Aug 1998 11:31:52 +1200
Content-Type:
text/plain
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text/plain (41 lines)
Hi all,

Wondering if any of you could help me out.

We are currently assembling a product which requires us to bolt
busbars on top of PC boards into the IGBT's below the board. This
connection can pass up to 90 AMPs through it. Some of the
boards we are receiving have solder build-up on the pads and we
are spending some time clearing it off to provide us with a flat
surface.

My question is : Does anyone have any experience with this type
of sandwiching of PC boards and the effects of solder on the pads?

Is there any standards which we can use?

Any help would be most appreciated.


Regards


Steve Plant
Electronic Production Engineer.
PDL Electronics LTD.
New Zealand.
Ph (06) 843-5855       Fax (06) 843-5185
Email   [log in to unmask]

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