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August 1998

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Subject:
Re: PC Board Surface Mount Solderability
From:
"<[log in to unmask]>" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 18 Aug 1998 15:57:16 -0400
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Check out IPC J-STD-003



Rob Carrillo <[log in to unmask]> on 08/18/98 03:34:17
PM

Please respond to "TechNet E-Mail Forum."
      <[log in to unmask]>; Please respond to Rob
      Carrillo <[log in to unmask]>

To:   [log in to unmask]
cc:    (bcc: Jason Smith/Lex/Lexmark)
bcc:  Jason Smith/Lex/Lexmark
Subject:  [TN] PC Board Surface Mount Solderability




Is there a standard for planarity and thickness of surface mount pads. Many
of boards received exhibit uneven HAL, yet meet MIL-PRF-55110F. As a
result, the side of the pad with the thinner solder coat exhibits advanced
stages of intermetallic growth. How do we, as an end user control this with
our supplier base?

Regards,
Rob Carrillo
Supplier Quality Engineer


Electronic Systems Division
Aerospace Group
Parker Hannifin Corp.
300 Marcus Blvd.
Smithtown, NY 11787
Tel: (516) 231-3737 X2049
Fax: (516) 348-1592

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