Les,
At a recent American Electroplater and Surface Finishers' Society Nat. Conv.
there two papers that said the distribution in the hole was better using
pulse plating and there was a report from the AESF(407-281-6441, Dick
Baker)Research Project 97 concerning this subject. Contact Technic, Inc,
Allan Read 401-785-8774 and Michael Kimble, Physical Sciences, Inc.
508-689-3232. If you need more or are stuck by one of these people please
let me know.
Richard Haynes
-----Original Message-----
From: Leslie O. Connally <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Monday, August 03, 1998 11:56 AM
Subject: Re: [TN] Plating Thickness
Hi Jaquet,
I have heard this touted for several years, and at TI in Austin,Tx
we
had several samples sent out to demonstrate the ability to plate more in the
hole than on the surface. The suppliers were never able to demonstrate the
capability. The panels always came back with more plating on the surface
than
in the hole. We tried at least to suppliers that made the claim. I would be
interested in the supplier, either of Pulse plating equipment or Plating
Chemistry, that can verify the claim.
Thanks,
Les Connally
> From: Lanoline <[log in to unmask]>, on 7/29/98 6:56 PM:
> Hi Sarah,
>
> Yes it is possible that the plating thickness on the surface is less than
in
> the hole, in particular if the plating was done using the Pulse Plating
> technology.
>
>
> -----Message d'origine-----
> De : sarah <[log in to unmask]>
> + : [log in to unmask] <[log in to unmask]>
> Date : mercredi, 29. juillet 1998 15:39
> Objet : [TN] Plating Thickness
>
>
> >Hi everyone
> >
> >Please pardon me for my ignorance regarding this
> >matter but I will ask this question anyway:
> >- is it possible that the plating thickness on the board
> > surface is less than that of the T/H?
> >- what might be the cause of this type of phenomenon?
> >
> >Any comments or information anyone could provide
> >is highly appreciated.
> >
> >
> >thanks
> >Sarah
> >
> >################################################################
> >TechNet E-Mail Forum provided as a free service by IPC using LISTSERV
1.8c
> >################################################################
> >To subscribe/unsubscribe, send a message to [log in to unmask] with
following
> text in the body:
> >To subscribe: SUBSCRIBE TechNet <your full name>
> >To unsubscribe: SIGNOFF TechNet
> >################################################################
> >Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
section
> for additional information.
> >For technical support contact Hugo Scaramuzza at [log in to unmask] or
> 847-509-9700 ext.312
> >################################################################
> >
> >
>
> ################################################################
> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV
1.8c
> ################################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
following
> text in the body:
> To subscribe: SUBSCRIBE TechNet <your full name>
> To unsubscribe: SIGNOFF TechNet
> ################################################################
> Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
section
> for additional information.
> For technical support contact Hugo Scaramuzza at [log in to unmask] or
> 847-509-9700 ext.312
> ################################################################
>
>
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following
text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section
for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or
847-509-9700 ext.312
################################################################
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################
|
