Subject: | |
From: | |
Reply To: | Leslie O. Connally |
Date: | Fri, 28 Aug 1998 13:04:34 -0500 |
Content-Type: | text/plain |
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Hi Jeremy,
I'll try to answer this one, with somewhat "tongue in cheek". As I recall the
terminology came from some early Multichip Module acronyms meaning Sequential
Lamination Module (SLAM). This was a sequentially laminated reinforced resin
fanout MCM. We built some as a carrier for BGA's to mount to a less complex
printed wiring board. The proper terminology was MCML. I could be wrong, but
this is my recollection. Anyone else recall ??
Regards,
Les
> From: Jeremy Drake <[log in to unmask]>, on 8/26/98 2:25 PM:
> Anyone in Technet land heard of slam electronic packages? I can't find them
> as a JEDEC outline. Do they exist? What are they?
>
> regards, Jeremy Drake
> Celestica
>
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