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August 1998

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Subject:
From:
Mike Lang <[log in to unmask]>
Reply To:
"TechNet E-Mail Forum." <[log in to unmask]>, Mike Lang" <[log in to unmask]>
Date:
Fri, 14 Aug 1998 13:29:21 -0400
Content-Type:
text/plain
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text/plain (47 lines)
I would like to expand my PCB assembly capabilities to
include top-side SMT plus top-side though hole.  The
process, as most of you know, is:

Stencil Solder Paste
Pick and Place SMT
Reflow
Autoinsert Through Hole Components
Wave Solder

Bottom side SMT can also be applied before wave.

MY CONCERN: Stress on the topside SMT components /
solder joints resulting from the autoinsert process (or any
other stress).

MY QUESTION: What has been done in this field, what
information is available, what concerns/work-arounds exists,
etc?  How is this best brought online?

Thanks,

Mike

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