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August 1998

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From:
Mark Simmons <[log in to unmask]>
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Date:
Wed, 19 Aug 1998 07:24:50 -0700
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Yee, the water is pretty muddy our there with regard to surface finish
alternatives.  One problem is, there seems to be an assumption that a
"one size fits all" product or process exists or will.  I think this is
a mistake.

I always cringe when i read the ever popular "HASL" bashing posts, like
the recent one which portrays it as "gothic"?

The fact is, there are a lot of levels of packaging density out there.

HASL is a robust process with excellent solderability and sheflife when
done correctly. It may not be the correct choice on high density
designs.

Talking about surface finish alternatives without being specific about
application is well...more heat than light, eh?

Polling users without knowing there application can't be of much use.

Mark Simmons

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