Hi all,

        There has been many kinds of surface finishing products out there.
     I know there has been many discussions on the Technet about this,
     especially the comparison between Entek OSP coating and HASL. But
     there were less talking about comparisons between other finishings,
     such as electroless Ni/immersion gold, alphalevel, plated tin, etc.

        I would like to know what are your (assemblers and pbc fabricators)
     opinions about these finishing, namely:

        1. Hot Air Solder Leveling
        2. Entek OSP Cu106A
        3. Entek OSP Cu66
        4. Electroless Ni/Immersion gold
        5. Alphalevel
        6. Plated tin

        What are the pros and cons of the processes, in terms of process
     stability, cost, shelf live, and solderability test conformance?

        And also, is there any other new surface finishing product that is
     gaining popularity in the market?

     TIA.

     Regards,
     Yee TG

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