Greetings Technet,

 Dose anyone know of a encapsulating material for electronics, which can
meet  the majority of these parameters?  We have been searching for about a
year and have had little success.

The Ideal Encapsulation Material

a.  low toxicity
b.  low moisture permeability
c.  no or very low ionic content
d.  low viscosity
e.  low linear shrinkage
f.  low glass transition temperature (Tg)
g.  low Coefficient Of Expansion (CTE)
h.  low embedment stress
i.  high tensile strength
j.  high thermal conductivity
k.  void free
l.  electrical insulation properties
m.  thermal cycling stability
n.  high thermal shock resistance
o.  wide temperature range -55 to 95 degrees C
p.  good chemical and solvent resistance
q.  good adhesion
r.  low cost
s.  ease of processing (application and clean up)
t.  no formation of water
u.  non-corrosive
v.  easily repairable


Your help is appreciated...

Ed Boucher
Engineering R&D Tech.
K and M Electronics
413-263-6253

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################