Hi All -

On the questions of reforming SOIC's and living without a heel fillet:

The industry has done a significant amount of testing ever since flatpacks
appeared back in the late 1960's that indicates the heel fillet is the
strongest point of the soldered connection when it comes to reliability of the
joint.

As several folks have previously stated, reforming this lead offers a distinct
possibility that the seal of plastic to lead will be compromised.

Finally, none of us out here really know just how severe an environment this
article is headed for, but the application of class 3 workmanship requirements
by the customer certainly suggests a major concern for either life, mission or
both.

Unpleasant as it may seem, manually placing these parts so that one set of
leads is normal to the pads, and the other set of leads is extended bith short
soldered on wires, then adhesive staking the part bodies and wires would
probably yield a few engineering units which would withstand dynamic testing,
including ESS.  It sounds as if use of such a technique would probably require
customer approval.

Regards - Kelly

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################