Does anybody have problems populating their boards with components
and screening shields at the same time,  and ensure a full flow
of solder all the way round the footprint, without any blowholes
(i.e. no reworking)  and without the solder creeping up the walls and
of the board.

We have a solution which is now in mass production in the mobile phone
sector that has shown a BIG increase in the process yield.

I would be interested to see if other people have different ways of
achieving it.

Your feed back would be greatly appreciated

Noel Cherowbrier

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