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August 1998

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Subject:
From:
Matthew Park <[log in to unmask]>
Reply To:
"TechNet E-Mail Forum." <[log in to unmask]>, Matthew Park" <[log in to unmask]>
Date:
Fri, 21 Aug 1998 12:42:26 -0700
Content-Type:
text/plain
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text/plain (77 lines)
Hmm... Let's see.  Why paste sticks to the uplifting squeegee is
indeed a strange phenomenon.   After many bushwhacking
ideas, it is because paste is lighter than the gravitational force
pulling down on it........  De-magnatization of solder paste can
help sometimes, but my experience told me otherwise.
No, no, no,  I think not, I think you need to massage solder
paste a little bit.  Stroke solder paste back and forth on a blank
stencil for a few dozen times.  That will loosen up the paste and
make it flow better.   Oh, think you should stuff more solder paste
on the stencil and see the paste roll  when printing.  Check your
speedo meter and make sure it doesn't go over a speed limit
when you do this.  If it just slides on the stencil or sticks to the
squeegeee, the stencil is obviously too oily.

Force be with you over the weekend.

>>> "Hamilton, Richard -4454" <[log in to unmask]>
August 21, 1998  10:30 am >>>
Hello to all,

Well we are finally testing our SM capabilities, we are brand new
at this.
We have an issue at paste printing that I would like everyone's
input on.

When the squeege makes it's pass on the stencil and then lifts
upward off
the stencil, the majority of the paste remains with the squeege
instead of
on the stencil.

What factors are there in the paste charactistics when applied?

Thank you all in advance.

Richard Hamilton
Clemar Mfg. / Rain Bird
[log in to unmask]

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