Kelly Kovalovsky wrote:
>
> We typically receive no cost reduction from the PWB manufacturers for switching
> from HASL to OSP or vice versa.  This applies in a general case. If there is a
> particular advantage to the supplier to get away from solder (say you have a
> very stringent requirement of no solder on the gold contacts of a board) then
> you may get cost advantages in isolated cases.
>
> In the case of the assembly house, it depends. It depends on how much better
> your yields get with the advantages (flat solderable surfaces) of the OSP. Or
> how much worse your yields get with the OSP. (handling and storage related
> issues)
>
> There is some Assembly process learning curve with the OSP, but in my opinion,
> if you are going to start working in the 0.020" pitch SMT and under arena, you
> should get on the curve.
>
> Kelly Kovalovsky
>
> [log in to unmask] on 08-06-98 01:27:38 PM
> Please respond to [log in to unmask]
> To: [log in to unmask]
> cc:
> Subject: [TN] HASL v/s OSP
>
> Fab/Assembly Expert:
> I have two questions related to price reduction if I change my pcb surface
> finish from HASL to OSP coating (Enthone CU106A).
>
> (1) How much price reduction (in terms of %) can I expect from fab house?
> (2) And also how about cost reduction from assembly house?
>
> You can provide me the range if number of layers matters.
>
> re,
> Ken Patel
> ______________________________________________________
> Ken Patel                       Phone:  (408) 490-6804
> 1708 McCarthy Blvd.             Fax:    (408) 490-6859
> Milpitas, CA 95035              Beeper: (888) 769-1808
>
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> ################################################################Price should not be the issue. It should be performance issues such as
solder joint strength, long term reliability, easse of assembly.

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