>Hey Ed. What a challenging question! As far as I can see HTCC (High
Temperature Cofired Ceramic) could be a aspirant. If you really mean
encapsulation=packageing. Ask Kyocera in the US or in Japan. Have a look at
Intel's Pentium for instance /Ingemar


Greetings Technet,
>  
>  Dose anyone know of a encapsulating material for electronics, which can
> meet  the majority of these parameters?  We have been searching for about a
> year and have had little success.
>  
> The Ideal Encapsulation Material
>  
> a.  low toxicity
> b.  low moisture permeability
> c.  no or very low ionic content
> d.  low viscosity
> e.  low linear shrinkage
> f.  low glass transition temperature (Tg)
> g.  low Coefficient Of Expansion (CTE)
> h.  low embedment stress
> i.  high tensile strength
> j.  high thermal conductivity
> k.  void free
> l.  electrical insulation properties
> m.  thermal cycling stability
> n.  high thermal shock resistance
> o.  wide temperature range -55 to 95 degrees C
> p.  good chemical and solvent resistance
> q.  good adhesion
> r.  low cost
> s.  ease of processing (application and clean up)
> t.  no formation of water
> u.  non-corrosive
> v.  easily repairable
>  
>  
> Your help is appreciated...
>  
> Ed Boucher
> Engineering R&D Tech.
> K and M Electronics
> 413-263-6253
>