Ruben,

Have you plotted a profile?

Have you secured a copy of the Solder Paste Manufacturer's recommended profile?

Are you within the specifications for rise rate, soak time, time above
reflow and maximum temperature?

First thing you should do is look for an area of your reflow process that
does not comply with the solder paste's profile requirements.

To answer your question, yes rise rate and maximum temperature can help
eliminate your problem (but only if they are the root of the problem).
Perhaps you should share with the rest of us the results from profile
testing as well as the solder paste requirements. I am sure that with that
information us Technetters can offer better advise.

If you would like to discuss further you can contact me offline.

Sincerely,

Brian Stumm



ETS, LLC - West                      ETS, Inc. - East
3939 N. Freya St.                    PO Box 47887
Spokane, WA 99207                    Plymouth, MN 55447
509-483-0900 (voice)                 612-553-0051 (voice)
509-483-0331 (fax)                   612-553-0246 (fax)
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Benefit from a direct relationship with the manufacturer!

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