TechNet readers,

I am having a problem with thru-hole and blind via's on lands.  The design
engineers in our microwave division insist that it is essential for circuit
performance to have the circuit connection as close to the part terminal as
possible.  In microwave terms that means a via on the land at the point the
part lead contacts the land - often right were the solder fillet is suppose
to form.

I've seen a paper on conductive silver epoxy used to fill via's on lands
but finding a board fabricator familiar with the process is difficult at
best.

Does anyone have a better way to resolve the problem?

Thanks
Larry Grazian

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