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August 1998

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Subject:
From:
Aric parr <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 14 Aug 1998 14:03:22 EDT
Content-Type:
text/plain
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text/plain (123 lines)
Most of the industry is autoinserting through hole with SMD on one or both
sides of the panel. I've done it with top side SMD since the mid '80s at
various employers.

You'll get more problems with backwards parts, high parts, missing parts,
wrong parts... from hand insertion.

I've never heard of problems related to stressing parts with standard
clinching and areas.

ARIC PARR
Sr. Manufacturing Engineer
Eaton Corp
1400 S. Livernois
P. O. Box 5020
Rochester Hills, Mi 48308-5020
[log in to unmask]
248 608 7780
Fax: 248 656 2242
-------------
Original Text
From: C=US/A=INTERNET/DDA=ID/TechNet(a)IPC.ORG, on 8/14/98 1:54 PM:
To: Aric Parr@01635@Lectron_RH,
EatonWHQ@CorpMail@WHQCleveOH[C=US/A=INTERNET/DDA=ID/TechNet(a)IPC.ORG]

Complete Subject:            Re: [TN] QUESTION: SMT Topside plus Through Ho
                             le Insertion Stress

----------------------------- [X.400 Text Follows]
-----------------------------
Mike,
        No question your board is going to be stressed by the
auto-insert process, no matter how well adjusted your cut/clinch is.
Better off to handload your through hole if you can....

Mike McMonagle
PCA Process Supervisor
K*Tec Electronics
(281) 243-5639

> -----Original Message-----
> From: Mike Lang [SMTP:[log in to unmask]]
> Sent: Friday, August 14, 1998 12:29 PM
> To:   [log in to unmask]
> Subject:      [TN] QUESTION: SMT Topside plus Through Hole Insertion
> Stress
>
> I would like to expand my PCB assembly capabilities to
> include top-side SMT plus top-side though hole.  The
> process, as most of you know, is:
>
> Stencil Solder Paste
> Pick and Place SMT
> Reflow
> Autoinsert Through Hole Components
> Wave Solder
>
> Bottom side SMT can also be applied before wave.
>
> MY CONCERN: Stress on the topside SMT components /
> solder joints resulting from the autoinsert process (or any
> other stress).
>
> MY QUESTION: What has been done in this field, what
> information is available, what concerns/work-arounds exists,
> etc?  How is this best brought online?
>
> Thanks,
>
> Mike
>
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