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August 1998

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Subject:
From:
Haugaard Svend <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 5 Aug 1998 08:24:54 +0200
Content-Type:
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text/plain (32 lines)
We have used hotmelt for quite a while with good results. It's inexpensive
and easy to use. You only need to secure that parts to be glued in this way
can withstand the (most likely small) amount of heat that is needed to melt
the glue.

When the demand is for bonding eg. several large capacitors on the PWA we
sometimes use a foam part. The part is then cut out to fit & fix exactly
those components needed to be fixed - eg. with a hole for each capacitor.
You have probably seen likely foam parts used in carrying cases for tools
etc.

At todays market of polyurethane compounds you should be able to find one
that fits exactly to your requirements. So I don't see any reasons for
getting into trouble this way.

Best regards
Svend Haugaard
Quality Department, Building Controls Division Electronics Manufacturing
Danfoss A/S http://www.danfoss.com

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