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August 1998

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Subject:
From:
Peter Swanson <[log in to unmask]>
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Date:
Thu, 6 Aug 1998 18:15:42 GMT
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In message  <[log in to unmask]> [log in to unmask] writes:
> Greetings!
>
> Our assembly floor currently uses a polyurethane molding compound to
> spot bond jumper wires and components to printed circuit boards.  It has
> a shelf life of 1 month @ -40 C and a working / pot life of < 30
> minutes.  I may be new to the assembly side of this business, but surely
> there has to be a more user friendly material out there!  Would anyone
> be so kind as to point me in the right direction and share information
> on what works and what doesn't?  You may e-mail me directly.

I wrote an article on the options in the UK magazine _Electronic Production_,
March 1992. I can fax a copy to you if you send me your fax number, by e-mail,
off the forum.

Peter
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Peter Swanson                                              Oxfordshire, England
INTERTRONICS
[log in to unmask]                      http://www.cygnetuk.demon.co.uk

Suppliers of materials and consumables to the electronics & related industries
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