I have used high temperature cyanacrylates with good success. They are
available from multiple suppliers with 3 second to several minutes until
set and many survive at least 1 bottomside wavesolder cycle. I have also
used hot melts for some top side applications, but it has limited
applications due to processing and melting temperature issues.

You can also use SMD glue and a heat gun.

ARIC PARR
Sr. Manufacturing Engineer
Eaton Corp
1400 S. Livernois
P. O. Box 5020
Rochester Hills, Mi 48308-5020
[log in to unmask]
248 608 7780
Fax: 248 656 2242
-------------
Original Text
From: C=US/A=INTERNET/DDA=ID/pws(a)cygnetuk.demon.co.uk, on 8/6/98 1:35 PM:
To: Aric Parr@01635@Lectron_RH,
EatonWHQ@CorpMail@WHQCleveOH[C=US/A=INTERNET/DDA=ID/TechNet(a)IPC.ORG]

In message
<[log in to unmask]>
[log in to unmask] writes:
> Greetings!
>
> Our assembly floor currently uses a polyurethane molding compound to
> spot bond jumper wires and components to printed circuit boards.  It has
> a shelf life of 1 month @ -40 C and a working / pot life of < 30
> minutes.  I may be new to the assembly side of this business, but surely
> there has to be a more user friendly material out there!  Would anyone
> be so kind as to point me in the right direction and share information
> on what works and what doesn't?  You may e-mail me directly.

I wrote an article on the options in the UK magazine _Electronic
Production_,
March 1992. I can fax a copy to you if you send me your fax number, by
e-mail,
off the forum.

Peter
--
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:::
Peter Swanson                                              Oxfordshire,
England
INTERTRONICS
[log in to unmask]
           http://www.cygnetuk.demon.co.uk

Suppliers of materials and consumables to the electronics & related
industries
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:::

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