Has anyone heard of a possible quality problem with SMT Ceramic caps that
come into a house in bulk form.  There is a question about the devices
banging together like crackers in a poly bag.  Basically, chips of the
caps, or crumbs of the crackers, will crack off and go to the bottom of the
baggy.  I have been told that due to this immeasureable damage, future
stresses to these components could cause the components to fail.  Is there
any validity to this hypothesis or is this an old Aerospace wives tale?


Thx
Bill Z.

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