We are an electronics manufacturing company starting to face the problems
of handling moisture sensitive components.  I am interested in finding out
what other companies are doing in this area.

Our initial thoughts on the subject are that we will get the moisture
ratings  from the manufactures and we will handle them and consume them
within the times and conditions outlined in J-STD-020.  Right now, doing
something less than this does not appear to be an option.

Based on following the times and conditions outlined in J-STD-020 here are
some questions  that come to mind:

     -  Once the original manufacture's packaging has been opened, is
re-packaging an option?
     -  My understanding is that the shelf life on packaged components is
12 months.  If we re-package, does the 12             month clock start
over, and if so, is there a document or standard that covers this part of
the issue?
     -  If re-packaging is an option, what are the different methods out
there and their pro's and cons?
     -  What are the logistics of handling these components from the stock
room to the production floor?
     -  If moisture sensitive components are going to be soldered by hand,
do we need to be concerned with the special      handling issue, and if
not, is there a document or standard that covers this?
     - Are there any other issues that might come up that go along with
moisture sensitive components?
     - Are there any other industry standards that might help support and
document what we do?

If there is anything else I might need to be aware of,  please throw it in.
Any information that anyone can supply will be a great help.  Thanks for
your time.


Neal Driscoll

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