I once worked on a similar application with steel plates that we
subsequently soldered, and had the parts barrel plated with tin.

ARIC PARR
Sr. Manufacturing Engineer
Eaton Corp
1400 S. Livernois
P. O. Box 5020
Rochester Hills, Mi 48308-5020
[log in to unmask]
248 608 7780
Fax: 248 656 2242
-------------
Original Text
From: C=US/A=INTERNET/DDA=ID/TechNet(a)IPC.ORG, on 8/12/98 8:10 AM:
To: Aric Parr@01635@Lectron_RH,
EatonWHQ@CorpMail@WHQCleveOH[C=US/A=INTERNET/DDA=ID/TechNet(a)IPC.ORG]

Louis, Edwin wrote:
>
>        WE have a situation where some electroless nickel plated items
> that
>      come in from a vendor are some times solderable with RMA flux and
>      other times requires an organic acid flux to do the job.
>        Someone told us that the phosphorus content may make the
> difference
>      and someone else suggested that included organics may cause this.
> Any
>      comments or experiences with this.
>
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All of the above suggestions are possibilities.
One other possibility is the tendency for any nickel deposit to passivate
readily, thus making the deposit difficult to solder.
Can you suggest putting a flash deposit of gold down to help?

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