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August 1998

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Subject:
From:
"McMonagle, Michael R." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum." <[log in to unmask]>, "McMonagle, Michael R." <[log in to unmask]>
Date:
Fri, 21 Aug 1998 16:17:24 -0500
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text/plain
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Folks,
        We are converting an assembly from HASL to gold that has large
quantities of 20mil devices. With HASL boards, we used a rule of thumb
of 2mil off of aperture width on these parts, 1mil on each side. Based
on the lack of pre-existing solder, should we go 1:1 on the gold board
stencil apertures? One of our engineers is recommending this, but I am
concerned about the possibility of bridging on 14mil wide pads. Our
stencils are 6mil laser cut/electropolish. Any insights would be
appreciated....

Mike McMonagle
PCA Process Engineering Supervisor
K*Tec Electronics
1111 Gillingham Lane
Sugar Land, TX  77478
(281) 243-5639 Phone
(281) 243-5539 Fax
[log in to unmask]

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