TECHNET Archives

August 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"McMonagle, Michael R." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum." <[log in to unmask]>, "McMonagle, Michael R." <[log in to unmask]>
Date:
Sat, 22 Aug 1998 07:48:12 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (121 lines)
        Thanks to everyone for the prompt responses, it validated my
concerns (I was right, nyah, nyah, nyah!). We're getting another stencil
burned right now with 12mil aps, the 1:1 stencil originally specd was a
disaster, 4-6 bridges every board.

        Now to another topic: What are your  experiences with mask
dams/webbing and fine pitch? In previous lives, I tried to specify mask
between pads on 25mil and under. This seemed to help minimize bridging
potential. However, I am now dealing with people higher up that have had
bad experiences with this practice, and I want to bring about a dialog
to pursue some process experiments.

        Step up to the pulpit and tell it like it is, brother (or
sister). Amen!

Mike McMonagle
PCA Process Engineering Supervisor
K*Tec Electronics
1111 Gillingham Lane
Sugar Land, TX  77478
(281) 243-5639 Phone
(281) 243-5539 Fax
[log in to unmask]

> -----Original Message-----
> From: Stephen R. Gregory [SMTP:[log in to unmask]]
> Sent: Friday, August 21, 1998 6:14 PM
> To:   [log in to unmask]
> Subject:      Re: [TN] Stencils for Gold Boards -Reply
>
> In a message dated 8/21/98 2:44:24 PM Pacific Daylight Time,
> [log in to unmask]
> writes:
>
> <<  Just one note, all reflowed solder joints have dull or
> gray-looking
> appearance.  That's normal.  Gold diffuses into melting solder causing
> dull or
> gray-looking solder joints. >>
>
> Hi Mike!
>
>      Matthew gives you good advice about your apertures. About his
> comment of
> the solder joints looking dull and grainy on gold boards, I got a tip
> for you
> to make em' look better, use a 2% silver solder with them (62/36/2).
> It lowers
> the melting temp a little...I think liquidous is 179 C. vs. 183 C.
> with a
> 63/37, and that ain't all that different, it's still eutectic, and it
> shouldn't cost much different (if you get charged anything different
> at all)
> from a regular ol' 63/37.
>
>      I worked at a memory company a couple of years ago where we had
> quite a
> few gold boards and that's what we used and our vendor charged us the
> same
> price...I'm not a metallurgist, so I can't tell you PRECISELY why the
> joints
> look better with a 2% silver, but they do, I'm not pulling your leg
> either...
>
>       I do remember reading something quite a while back that there
> was a
> mistaken belief floating around that if you used silver in your solder
> that it
> would prevent the leeching of the gold into the joints during
> reflow...something about the silver in the solder being a noble metal
> like
> gold is, raises the percentage of noble metal in the solder joint
> which
> reduces the leeching of the gold. We all know now that's not true, but
> I'm
> thinking maybe where that belief may have gotten started was
> difference in the
> solder joint appearance...someone may have thought back then that the
> addition
> of silver really did stop the gold leeching.
>
> -Steve Gregory-
>
> ################################################################
> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV
> 1.8c
> ################################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
> following text in the body:
> To subscribe:   SUBSCRIBE TechNet <your full name>
> To unsubscribe:   SIGNOFF TechNet
> ################################################################
> Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
> section for additional information.
> For technical support contact Hugo Scaramuzza at [log in to unmask] or
> 847-509-9700 ext.312
> ################################################################

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2