Hi there,
Look at what your process tells you. If it works well (no bridging / no
shorts) you have a good combination of board/printer/stencil/paste/setup.
(Yup, they all contribute more or less and have to be taken into be
controlled!) On the other hand, if it does not work change a parameter. If
you choose to change aperture size and you have control over the aperture
library, by all means do it there. If you have no control over the aperture
sizes ask your stencil manufacturer to change specific or all apertures -
we, and most others, can do that. (see my reply, 24Aug98, to: "Stencils for
gold boards.)

Regards, Ahne.
(503)641-9428

-----Original Message-----
From:   TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
Sent:   Thursday, August 27, 1998 10:45
To:     [log in to unmask]
Subject:        [TN] solder stencil

General Question to anyone. If you were to go out and build the ideal
stencil for
pasting boards, what would be the best way to build a stencil? I have some
boards
that have 19.7 mil pitch parts and the pad width is 10 mil. The length of
the pad is
59 mil. I can't change the pad design. Ideas I am looking for are opening
sizes of the
apperatures, what type of etching, what type of plating, and thickness of
the stencil.
Other ideas are appreciated. Thank you in advance.

Rob

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