Rick,

Mil-STD-2000A has a bunch of lead tinning requirements.  They require a
segregation of the tinning area away from other areas if the flux used is
anything but type R or RMA.  They also specify maximum contamination limits
on tinning pots and separate limits on Assembly soldering.  If you use a
non-rosin flux you must also provide certain data on cleanliness testing.  I
believe it also requires Mil-Std-2000 certification of personnel which may
not be possible for you to get any longer.  You may need a waiver for this
one.

If you build to this standard you will want to understand it thoroughly.
Let me know and I'll send you a copy of the standard.  My copy of
Mil-Std-2000A is dated 14
February 1991.

Good Luck

Russ Winslow

[log in to unmask]

-----Original Message-----
From: Rick Thompson <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Thursday, August 27, 1998 1:51 PM
Subject: [TN] MIL-2000 Lead Tinning?


>Hi,
>
>We have a customer who is requesting a quote to build PCBAs with a
>requirement for lead tinning & 'single-point' soldering per Mil-2000.  He
>knows that Mil-2000 has been superceded but their customer is still
>requiring it.  I don't have a copy of Mil-2000 and was wondering if someone
>could briefly tell me what the lead tinning requirements of the spec were,
>was it a requirement at all times or only when solderability testing
failed,
>etc.  Also, what the term 'single-point' soldering refers to; I'm not
>familiar with the term.
>
>Thanks.
>
>                Rick Thompson
>                Ventura Electronics Assembly
>                2665A Park Center Dr.
>                Simi Valley, CA 93065
>
>            [log in to unmask]
>
>                (805) 584-9858 voice
>                (805) 584-1529 fax

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