I think everyone would like to know the answer to this one!  If anyone
does, please share the response on TechNet!

>-----Original Message-----
>From:  Edward Boucher [SMTP:[log in to unmask]]
>Sent:  Wednesday, August 12, 1998 2:49 PM
>To:    [log in to unmask]
>Subject:       [TN] The ideal eletronic encapsulation material?
>
>Greetings Technet,
>
> Dose anyone know of a encapsulating material for electronics, which can
>meet  the majority of these parameters?  We have been searching for about a
>year and have had little success.
>
>The Ideal Encapsulation Material
>
>a.  low toxicity
>b.  low moisture permeability
>c.  no or very low ionic content
>d.  low viscosity
>e.  low linear shrinkage
>f.  low glass transition temperature (Tg)
>g.  low Coefficient Of Expansion (CTE)
>h.  low embedment stress
>i.  high tensile strength
>j.  high thermal conductivity
>k.  void free
>l.  electrical insulation properties
>m.  thermal cycling stability
>n.  high thermal shock resistance
>o.  wide temperature range -55 to 95 degrees C
>p.  good chemical and solvent resistance
>q.  good adhesion
>r.  low cost
>s.  ease of processing (application and clean up)
>t.  no formation of water
>u.  non-corrosive
>v.  easily repairable
>
>
>Your help is appreciated...
>
>Ed Boucher
>Engineering R&D Tech.
>K and M Electronics
>413-263-6253
>
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