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Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 3 Aug 1998 10:43:25 -0500 |
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Good morning Technetters!
Hopefully I have given everyone enough time to ingest their favorite
form of artificial adrenaline (AKA caffeine) to get you moving on a
Monday morning. I could use your expertise for the following concern:
I searched thru the archives but could not find direct info on this:
I am crunching numbers for a high-throughput bottomside
(glue-n'-chips, then wave) product, and in order to meet the rate
required, I am considering stenciling glue instead of dot-dispensing.
The concern is that I have a few auto-insert radial components (not
available in SMD) that then must be inserted AFTER the glue stencil
operation.
My question:
1) Should I be concerned about the forces of radial auto-insertion
and clinch causing problems with my glued-but-unsoldered chips?
2) If someone has already been thru this, is there anything special
you had to do (tooling, prayers) to insure chips were not flying in
all directions? What were your success/failures?
Any feedback would be greatly appreciated.
Jeff Hempton
United Technology Electronic Controls
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