TECHNET Archives

August 1998

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: Electroless Nickel
From:
Paul Klasek <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 3 Aug 1998 08:31:59 +1000
Content-Type:
text/plain
Parts/Attachments:
text/plain (64 lines) 
Rudy ,
could you please do us a favor and reflect on this subject ?
I work on NiAu as well ; appreciate it

Thanks a lot

Paul Klasek
http://www.resmed.com

> ----------
> From:         Earl Moon[SMTP:[log in to unmask]]
> Sent:         Friday, 31 July 1998 21:57
> To:   [log in to unmask]
> Subject:      [TN] Electroless Nickel
>
> It has recently, and disruptively, been brought to my past ignorant
> attention the problem associated with electroless nickel deposition
> under electroless gold deposited SMT solder termination areas. I have
> been informed, by a major BGA supplier, the deposition process relies
> on
> phosphorous as a component in the plating solution. Further, I have
> been
> told this is detrimental to solder joint formation.
>
> It is said, and has been proven by the BGA supplier, that phosphorous
> causes solder joint problems by forming an internetallic that, over
> time, causes embrittlement. Therefore, solder joints fail.
>
> Has anyone in industry addressed this issue from a PCB fabrication
> standpoint? If so - how, and what is being done? Can we specify
> electroplated nickel in approximately 100 millionths thickness as for
> electroless types? If so, will this overcome the intermetallic,
> embrittlement, and solder joint problem?
>
> Thanks, Earl Moon
>
> ################################################################
> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV
> 1.8c
> ################################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
> following text in the body:
> To subscribe:   SUBSCRIBE TechNet <your full name>
> To unsubscribe:   SIGNOFF TechNet
> ################################################################
> Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
> section for additional information.
> For technical support contact Hugo Scaramuzza at [log in to unmask] or
> 847-509-9700 ext.312
> ################################################################
>

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2