Hi Guys and Gals,
I'm currently in the middle of investigating pcb warp in some of our
products and trying to develop a 'top ten' of ways to reduce this problem
in our manufacturing plant. I would be grateful for any facts 'n' theories
on the subject. Typically our assemblies include medium to high mass
componentry on 4 to 6 layer 1.6mm FR4 up to 12" x 9" size.
Thanks in advance......

Justin Braime
Production Engineering
Alpine Electronics of New Zealand Ltd
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15a Vestey Drive, Mt Wellington,
Private Bag 14921, Panmure,
Auckland, New Zealand.
Phone: +64-9-573 7100
Fax: +64-9-572 7101
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