Hi Guys and Gals, I'm currently in the middle of investigating pcb warp in some of our products and trying to develop a 'top ten' of ways to reduce this problem in our manufacturing plant. I would be grateful for any facts 'n' theories on the subject. Typically our assemblies include medium to high mass componentry on 4 to 6 layer 1.6mm FR4 up to 12" x 9" size. Thanks in advance...... Justin Braime Production Engineering Alpine Electronics of New Zealand Ltd ------------------------------------------------------------ 15a Vestey Drive, Mt Wellington, Private Bag 14921, Panmure, Auckland, New Zealand. Phone: +64-9-573 7100 Fax: +64-9-572 7101 ------------------------------------------------------------- ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################