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August 1998

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Subject:
From:
Johannes Sivula <[log in to unmask]>
Reply To:
"TechNet E-Mail Forum." <[log in to unmask]>, Johannes Sivula" <[log in to unmask]>
Date:
Wed, 19 Aug 1998 09:47:34 +0300
Content-Type:
text/plain
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text/plain (54 lines)
You wrote:
"
Because of a vendor mis-hap we recieved pcbs with      palladium and not
tin plating.    We use a 2% silver solder so it is a good match.   We are
concerned with  any long term effects i.e. corrosion.
Can some of you please respond with your experience
with palladium and pcbs. Don Fumia  "

---------------------------------------------------------------------------
------------------------------------------------------------------
Hi,

We have made some preliminary trials with Palladium Process called "
electroless palladium "
by Atotech, with  formic acid as the reducing agent.

I suppose there is also a process called " immersion  palladium ".
Personally I think it gets too
thin and it is preferrably used as a activator in  Ni/Au- processes, for
example.

Well, in our case it worked fine, we are pleased with solderability. We
have not made environmental tests
& other tests so far, personally I think that corrosion is not a problem,
because palladium is the most
noble metal and hence it is almost impossible to get it corrode.

The real problem of palladiumin our case is availibility/price fluctuation
in Europe.
Brs, Johannes

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