Jeff
My opinion would be that as long as your auto-insert machine isn't hitting
the parts with the clinch mechanism you should be OK in that machine - check
the clearances.  However, consider that the boards will see a lot more
handling, and you will likely have a lot of missing parts from boards being
banged.  Ensuring good handling procedures and a good process flow will be
essential.

regards,

Graham Collins
Process Engineer
Litton Systems Canada
(902) 873-2000 extension 215
-----Original Message-----
From: Jeff Hempton [mailto:[log in to unmask]]
Sent: Monday, August 03, 1998 12:43 PM
To: [log in to unmask]
Subject: [TN] stencil printing bottomside glue


     Good morning Technetters!
       Hopefully I have given everyone enough time to ingest their favorite
     form of artificial adrenaline (AKA caffeine) to get you moving on a
     Monday morning. I could use your expertise for the following concern:
       I searched thru the archives but could not find direct info on this:
       I am crunching numbers for a high-throughput bottomside
     (glue-n'-chips, then wave) product, and in order to meet the rate
     required, I am considering stenciling glue instead of dot-dispensing.
     The concern is that I have a few auto-insert radial components (not
     available in SMD) that then must be inserted AFTER the glue stencil
     operation.
      My question:
     1)  Should I be concerned about the forces of radial auto-insertion
     and clinch causing problems with my glued-but-unsoldered chips?
     2) If someone has already been thru this, is there anything special
     you had to do (tooling, prayers) to insure chips were not flying in
     all directions? What were your success/failures?
       Any feedback would be greatly appreciated.

     Jeff Hempton
     United Technology Electronic Controls

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