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August 1998

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Subject:
From:
Nick Nicolaides <[log in to unmask]>
Reply To:
"TechNet E-Mail Forum." <[log in to unmask]>, Nick Nicolaides" <[log in to unmask]>
Date:
Mon, 24 Aug 1998 18:18:37 -0400
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text/plain
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text/plain (32 lines)
My book only goes to 70/30 (tin/lead). need help. Our part supplier is using
90/10 rather then 63/37. The higher tin causes more oxides creating some
cold solder joints. Supplier has brass base followed by copper flask and
90/10 tin/lead. What is the liquidus temperature of tin/lead of 90/10 and
has anyone had the experience. Also the feet to this part are very small and
close to the pad. Hard to inspect. We had the supplier go to 63/37 and had
very little problem. Supplier wants to go back to 90/10. whats the
concensus?

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