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August 1998

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Subject:
Re: reforming a SOIC
From:
"Vanech, Bob" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum." <[log in to unmask]>, "Vanech, Bob" <[log in to unmask]>
Date:
Wed, 26 Aug 1998 10:36:16 -0700
Content-Type:
text/plain
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text/plain (41 lines) 
     Graham..

                     I'm not totally sure about your problem with board/comp
  clearance, but I do share your concern with the possibility of breaking
  the lead seal - especially class 3 product. Would it be possible to fab
  a small adapter pwb with the correct footprint, solder the SOIC to that
  then attach that assy to the original pwb with pins or wire jumpers or
  the use of high temp solder? Good luck !!!
                     I understand that they are hiring in Bora Bora and the
only
  requirement is that you don't screw-up footprints..;-> Oh well.
  can't screw up footprints....  ;->   Oh well.


Bob Vanech

        ----------

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