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August 1998

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Subject:
From:
Melanie Racuya <[log in to unmask]>
Reply To:
"TechNet E-Mail Forum." <[log in to unmask]>, Melanie Racuya" <[log in to unmask]>
Date:
Mon, 24 Aug 1998 18:26:22 +0000
Content-Type:
text/plain
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text/plain (40 lines)
Hello netters
 We're using a with clean solder paste in the manufacturing of our
flex and I'm encountering  white residues  as seen after aqueous
cleaning. Can this be an effect of the flux content of the solder
paste that we are using? Or is it the cleanliness of the DI water
beign used by the aqueous cleaning machine (which is drained and
changed every end of the shift)? We tried reloading it in the aqueous
cleaner but it doesnt suffice cleaning the white residues. Will I be
needing another chemical or solvent to clean it up first before
reloading it in the aqueous machine?
By the way, did anybody among you have encountered this problem
before?
I need your help!

Thanks,
Bing

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