One possible way to eliminate the glue process is to use an "exclusion" or
masking fixture where you would
do solder side surface mount then load the board with radials into a
masking fixture which would selectively expose the PTH areas to the wave.

the rules for determining whether a board is suitable for this method are
fairly long winded. However if you would like to send the gerber info
(Solder paste,Silk screen,fab & drill) to us we will be able to
1. determine if your board is suitable
2. give you a quote for the manufacture of these

Regards

Chris Chapman
Datum Dynamics USA
(401) 683 5300

-----Original Message-----
From:   Jeff Hempton [SMTP:[log in to unmask]]
Sent:   Monday, August 03, 1998 11:43 AM
To:     [log in to unmask]
Subject:        [TN] stencil printing bottomside glue

     Good morning Technetters!
       Hopefully I have given everyone enough time to ingest their favorite
     form of artificial adrenaline (AKA caffeine) to get you moving on a
     Monday morning. I could use your expertise for the following concern:
       I searched thru the archives but could not find direct info on this:
       I am crunching numbers for a high-throughput bottomside
     (glue-n'-chips, then wave) product, and in order to meet the rate
     required, I am considering stenciling glue instead of dot-dispensing.
     The concern is that I have a few auto-insert radial components (not
     available in SMD) that then must be inserted AFTER the glue stencil
     operation.
      My question:
     1)  Should I be concerned about the forces of radial auto-insertion
     and clinch causing problems with my glued-but-unsoldered chips?
     2) If someone has already been thru this, is there anything special
     you had to do (tooling, prayers) to insure chips were not flying in
     all directions? What were your success/failures?
       Any feedback would be greatly appreciated.

     Jeff Hempton
     United Technology Electronic Controls

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