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August 1998

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Subject:
From:
"Neubauer, Terri" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 4 Aug 1998 16:19:14 -0400
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Greetings!

Our assembly floor currently uses a polyurethane molding compound to
spot bond jumper wires and components to printed circuit boards.  It has
a shelf life of 1 month @ -40 C and a working / pot life of < 30
minutes.  I may be new to the assembly side of this business, but surely
there has to be a more user friendly material out there!  Would anyone
be so kind as to point me in the right direction and share information
on what works and what doesn't?  You may e-mail me directly.

Also, it has been suggested that we eliminate our polysulfide sealant
for a polyurethane sealant.  Do sulfides make better electronic sealants
than urethanes?  Again, I would appreciate any and all suggestions.  Are
there any pitfalls I should avoid?

Thanks in Advance,

Terri Neubauer
Northrop Grumman - ESID
[log in to unmask]

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