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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 4 Aug 1998 16:19:14 -0400 |
Content-Type: | text/plain |
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Greetings!
Our assembly floor currently uses a polyurethane molding compound to
spot bond jumper wires and components to printed circuit boards. It has
a shelf life of 1 month @ -40 C and a working / pot life of < 30
minutes. I may be new to the assembly side of this business, but surely
there has to be a more user friendly material out there! Would anyone
be so kind as to point me in the right direction and share information
on what works and what doesn't? You may e-mail me directly.
Also, it has been suggested that we eliminate our polysulfide sealant
for a polyurethane sealant. Do sulfides make better electronic sealants
than urethanes? Again, I would appreciate any and all suggestions. Are
there any pitfalls I should avoid?
Thanks in Advance,
Terri Neubauer
Northrop Grumman - ESID
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