Greetings! Our assembly floor currently uses a polyurethane molding compound to spot bond jumper wires and components to printed circuit boards. It has a shelf life of 1 month @ -40 C and a working / pot life of < 30 minutes. I may be new to the assembly side of this business, but surely there has to be a more user friendly material out there! Would anyone be so kind as to point me in the right direction and share information on what works and what doesn't? You may e-mail me directly. Also, it has been suggested that we eliminate our polysulfide sealant for a polyurethane sealant. Do sulfides make better electronic sealants than urethanes? Again, I would appreciate any and all suggestions. Are there any pitfalls I should avoid? Thanks in Advance, Terri Neubauer Northrop Grumman - ESID [log in to unmask] ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################