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August 1998

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Subject:
From:
Gregory S Bartlett <[log in to unmask]>
Reply To:
"TechNet E-Mail Forum." <[log in to unmask]>, Gregory S Bartlett" <[log in to unmask]>
Date:
Tue, 25 Aug 1998 10:24:45 -0400
Content-Type:
text/plain
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text/plain (54 lines)
Ken,
I was considering the same situation a couple of years ago and asked the
same question in this forum.  Essentially, the answers indicated that the
older, single-reflow OSPs have been used for years (10+) in many
applications with compliant pin connectors with no problems, but that there
was not much data on the thicker multiple-reflow OSPs (which was being used
for the applications I was considering).  In the absence of this data, we
did our own testing (including shock/vibe, temp cycling, temp/humidity,
high temp tests) and found no problems.  Similarly, there have been no
problems with this combination on live products since introduced a year or
two ago.

I'd echo the point about ensuring that the fixturing and backing plate
being sound before proceeding.

Regards,
Greg Bartlett
Teledyne Electronic Technologies
Hudson, NH
[log in to unmask]
-------
In a message dated 08/24/98 7:16:37 PM Pacific Daylight Time,
[log in to unmask]
writes:

> Will there be any problem if my board surface finish is OSP and has a
>  press-fit connector?
>
>  Re,
>  Ken Patel

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