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Subject:	Solder Bridges under BGAs
From:	Nick Nicolaides <[log in to unmask]>
Reply To:	"TechNet E-Mail Forum." <[log in to unmask]>, Nick Nicolaides" <[log in to unmask]>
Date:	Tue, 25 Aug 1998 17:55:28 -0400
Content-Type:	text/plain
Parts/Attachments:	text/plain (31 lines)

Hi!
Our contract manufacturer employs HASL for the PCBs'. Previous to this the
CM was using OSP (Entek). He stated he has better quality using HASL PCBs.
However we are now experiencing some solder bridging under the BGA's. He is
using HASL,  WS 609 solder paste (6 mils), and what the solder bumps are on
the BGAs. This appears to be acceptable but why the solder bridging under
the BGA. What are your thoughts!

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